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GLOBAL CATALOG · SEMICONDUCTOR EQUIPMENT
Semiconductor Equipment, on the world map.
A curated catalog of real, publicly-listed products compiled from 1 cited sources. Country of origin sizes each node on the global pillar map.
Curated catalog of public products — not suppliers who have joined MPBx.
372
PRODUCTS
12
COUNTRIES
136
CATEGORIES
120
BRANDS
12 country nodes · 285 products placed by origin · sized by product count, not trade volume.
BY COUNTRY · MAP NODES
140
77
24
17
7
6
5
3
2
2
1
1
BY CATEGORY
CVD13
Dry Etch12
Epitaxy9
Pick-and-Place9
DUV Scanner8
ALD7
AOI7
CMP Polishing7
Memory7
PVD7
SoC/Logic7
Ball Bonder6
Bright-Field6
ECD6
Macro6
Probe Station6
Single Wafer Clean6
Vertical Furnace6
Wet Etch6
Blade Dicing Saw5
Coater/Developer5
Laser Marking5
Resist Strip5
RF5
SE + Reflectometry5
Wedge Bonder5
ALE4
Batch Wet Bench4
E-beam4
EUV Scanner4
Flip Chip Bonder4
High Current4
High Energy4
SEM Review4
Transfer Molding4
Unpatterned4
Compression Molding3
Dark-Field3
DBO3
Die Sorter3
Electroplating3
High-Resolution3
Integrated System3
Medium Current3
Multi-Module Bonder3
OCD + SE3
Optical Review3
Parameter Analyzer3
Probe Card3
Reflectometry3
RTP3
SE3
Test Socket3
Wafer Bonder3
X-Ray3
Analog2
AOI (Advanced Packaging)2
DBO/Scatterometry2
Epoxy Die Bonder2
Gravity Feed2
Implant Metrology2
Laser Anneal2
Laser Dicing2
MeV Implanter2
Mid-Range2
Photoresist Coater/Developer2
Plasma Doping2
Single-Beam2
Spectrum Analyzer2
Stylus Profiler2
Wafer Geometry2
Wireless Test Set2
XRF + XRR + XRD2
5G mmWave Tester1
AFM1
AOI (2D Surface)1
AOI (High-Res)1
AOI (Hybrid Bonding)1
AOI (Panel)1
Backside1
Bond Test1
Burn-in Socket1
C-SAM1
C-SAM / SAT1
CMP Cleaning1
DBG System1
Die Bonder1
Dynamic1
Dynamic Burn-in1
ECD Plating1
ECD RDL1
Edge Inspection1
Electroless Plating1
HAST1
Heavy Wire Bonder1
Heavy Wire Wedge1
High-Voltage1
Hybrid1
Hybrid Bonder1
IBO1
Inkjet Marking1
IR OCD1
Liquid Encapsulation1
Low-Voltage1
Memory Test1
Metrology1
Mixed-Signal1
Multi-Beam1
Multi-Surface1
Nanoimprint1
Optical Profiler1
Packaging1
Photoresist Coater1
Post-Dicing Inspection1
Research/Lab1
RF Socket1
Sheet Resistance1
Soft Solder Bonder1
Specialty1
Strip Test1
System Level Test1
Tape & Reel1
Taping Handler1
Taping System1
TCB1
Temperature Chamber1
Test Handler1
Thermal Forcing1
Thermocompression Bonder (TCB)1
Turret-Based1
Universal1
Vacuum Molding1
Vector Network Analyzer1
Vector Signal Generator1
VNA1
XPS1
FRONT-END · 136BACK-END · 94INSPECTION & METROLOGY · 90TEST · 52
SAMPLE · 24 OF 372
| BRAND | PRODUCT | CATEGORY | COUNTRY |
|---|---|---|---|
| Applied Materials | Endura 5500, Endura 2, Endura HT | PVD | USA |
| Lam Research | Altus, Vector PVD | PVD | USA |
| TEL | EXIM PVD | PVD | Japan |
| Veeco (CVC) | Explorer, Benchmark | PVD | USA |
| Applied Materials | Endura iPVD | PVD | USA |
| Applied Materials | Endura II, Endura TXZ | PVD | USA |
| TEL | TELINDY PLUS, ALPHA-8SE, EVAROS | CVD | Japan |
| ASM International | Intrepid, Advance | CVD | Netherlands |
| Applied Materials | Producer GT, Producer SE, Producer C | CVD | USA |
| Lam Research | Vector Express, Vector Excel, Vector Extreme | CVD | USA |
| Applied Materials | Producer HARP | CVD | USA |
| Applied Materials | Producer BPSG, Producer TEOS | CVD | USA |
| Aixtron | AIX G5+ C, AIX G5 C, AIX G5 HT | CVD | Germany |
| Veeco | K465i, MaxBright M, MaxBright MHP, EPIK 700 | CVD | USA |
| Veeco | Propel, Propel HVM, Propel 300mm | CVD | USA |
| TEL | Probus-SiC, Triase+ EX-II | CVD | Japan |
| ASM International | Pulsar AXIS, XP8 Synergis, XP4 EmerALD | ALD | Netherlands |
| ASM International | XP8 DCM PEALD, XP8 QCM PEALD, XP8 Magma | ALD | Netherlands |
| Applied Materials | Olympia ALD, Centura ALD | ALD | USA |
| Lam Research | Vector ALD, Altus ALD | ALD | USA |
| TEL | NT333 ALD, TELINDY PLUS IRad | ALD | Japan |
| Applied Materials | Raider ECD, Endura ECD, Sabre 3D | ECD | USA |
| Lam Research | SABRE 3D, Triton ECD | ECD | USA |
| Ebara | ECD 570, ECD 580 | ECD | Japan |