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SPEC PUZZLE · SEMI

Semiconductor packaging spec

18 specs · substrate type + bump pitch decide which OSAT can build it

SPEC PUZZLE · WHY IT EXISTS

Tired of reviewing every symbol in a contract?

33% of B2B orders ship wrong because spec drift hides in walls of text. Same data, two views — guess which one your eye reads in 250 ms.

① TEXT · WHAT YOU GET TODAY
SPEC SHEET12 ROWS · ABBREVIATED
CONTRACTPCB-2026-00042-A
PRODUCTCOPPER CLAD LAMINATE FR-4
GRADETg170 · Td330 · CTI 175
CONSTRUCTION4-LAYER · IPC-4101/126
COPPER WEIGHT1 oz / 35 µm
GLASS STYLE7628 × 4 ply
Dk @ 1 GHz4.4
PEEL STRENGTH≥1.4 N/mm
HALOGENfree · IEC 61249-2-21
IPC CLASS2
SURFACE FINISHENIG 50µ" / 200µ"
SOLDER MASKLPI green · Taiyo PSR-4000
~10 seconds to scan. Most buyers miss the drift.
same contract
② VISUAL · WHAT WE REPLACE IT WITH
PSG-0IWT-O500-5MOP
250 ms. Pre-attentive vision did the read.
IN YOUR DEAL
draft RFQsupplier quotesigncountersignphoto verifyaudit
one signature · six surfaces
Try it with your own spec. Paste a sheet, drop a photo, or fill the form — the puzzle assembles in real time.
TRY THE PUZZLE →
⚡ PASTE A SPEC SHEET · AI FILLS THE PUZZLE
Drop in a free-text spec from a PDF, email, or supplier datasheet. Claude Sonnet 4.6 normalizes units, reconciles bilingual values (e.g. 1/4" ↔ 6.35 mm), and fills the puzzle below with per-axis confidence. Confidence below 80% is flagged as unverified.
SPEC COMPLETENESS
8 MISSING · 0 MISMATCH
18 specs · 8 required
Core
Package
MISSING
Substrate
MISSING
Bump
MISSING
Bump pitch
MISSING
I/O count
MISSING
Ball pitch
MISSING
Sub layers
MISSING
AEC grade
MISSING
Die & interconnect
Node
UNVERIFIEDopt.
Die size
UNVERIFIEDopt.
RDL L/S
UNVERIFIEDopt.
TSV
UNVERIFIEDopt.
Thermal & reliability
TDP
UNVERIFIEDopt.
Lid / TIM
UNVERIFIEDopt.
Warpage
UNVERIFIEDopt.
Test & qual
JEDEC MSL
UNVERIFIEDopt.
Test flow
UNVERIFIEDopt.
Traceability
UNVERIFIEDopt.
VALIDMISSINGMISMATCHUNVERIFIED
FILL THE SPEC · LIVE-VALIDATED
⚡ AUTOFILL · PASTE YOUR SPEC
Core
Die & interconnect
Thermal & reliability
Test & qual
WHY THESE SPECS MATTER
Substrate (ABF vs BT vs glass vs fan-out RDL) and interconnect (Cu pillar / µbump / hybrid bond) gate which fabs can build the part — AI/HPC FC-BGA and 2.5D/3D HBM are sourceable from a handful of OSATs at volume. JEDEC MSL and AEC-Q100 grade gate the customer segment.
When the puzzle is complete, post the RFQ.
All verified specs flow into a structured RFQ with the spec snapshot frozen at submission.
Post RFQ with this spec →