Industrial & Plating Chemicals made in Japan
65 curated industrial & plating chemicals products with Japan as country of origin, spanning 47 categories and 29 brands. Part of the MPBxChange global sourcing catalog.
Curated catalog of public products — not suppliers who have joined MPBx.
65
PRODUCTS
47
CATEGORIES
29
BRANDS
INDUSTRIAL & PLATING CHEMICALS · JAPAN · 65 PRODUCTS
| BRAND | PRODUCT | CATEGORY |
|---|---|---|
| Stella Chemifa | Hydrofluoric Acid | Weak Mineral Acid (Highly Corrosive/Toxic) |
| Kanto Chemical | Hydrofluoric Acid | Weak Mineral Acid (Highly Corrosive/Toxic) |
| Stella Chemifa | Fluoroboric Acid | Fluorinated Mineral Acid |
| Mitsubishi Gas Chemical | Sulfamic Acid | Inorganic Sulfamic Acid |
| Mitsubishi Gas Chemical | Sulfamic Acid | Inorganic Sulfamic Acid |
| Tokyo Ohka Kogyo | Tetramethylammonium Hydroxide (TMAH) | Quaternary Ammonium Hydroxide (Organic Base) |
| TOK | Tetramethylammonium Hydroxide (TMAH) | Quaternary Ammonium Hydroxide (Organic Base) |
| Sachem | Tetramethylammonium Hydroxide (TMAH) | Quaternary Ammonium Hydroxide (Organic Base) |
| Sachem | Tetramethylammonium Hydroxide (TMAH) | Quaternary Ammonium Hydroxide (Organic Base) |
| BASF Electronic Materials | Copper Sulfate Pentahydrate | Metal Salt (Plating) |
| Stella Chemifa | Copper Sulfate Anhydrous | Metal Salt (Plating) |
| Stella Chemifa | Nickel Sulfate Hexahydrate | Metal Salt (Plating) |
| Stella Chemifa | Nickel Chloride Hexahydrate | Metal Salt (Plating) |
| Showa Chemical | Tin Sulfate | Metal Salt (Plating) |
| Stella Chemifa | Copper Pyrophosphate | Metal Salt (Plating) |
| Stella Chemifa | Cobalt(II) Sulfate Heptahydrate | Metal Salt (Plating) |
| Uyemura | Electroless Copper Plating Solution (Formaldehyde-based) | Electroless Plating Chemical |
| Uyemura | Immersion Gold Plating Solution (Displacement Gold) (ENIG / ENEPIG Gold Grade) | Electroless Plating Chemical |
| Stella Chemifa | Sodium Hypophosphite Monohydrate | Electroless Plating Chemical (Reducing Agent) |
| Sigma-Aldrich | Potassium Iodide | Electroless Plating Chemical (Stabilizer) |
| Honeywell | Sodium Hydroxide | Electroless Plating Chemical (pH Adjuster) |
| Kanto Chemical | Ammonium Hydroxide | Electroless Plating Chemical (pH Adjuster / Complexant) |
| JSR Micro | Positive Photoresist KrF (DUV 248nm) - CAR type (VLSI Grade) | Photoresist (Chemically Amplified) |
| JSR Micro | Positive Photoresist ArF (Immersion 193nm) - CAR type (VLSI Grade) | Photoresist (Chemically Amplified DUV) |
| DuPont | Photoacid Generator (PAG) - Triphenylsulfonium Triflate (Lithography Grade) | Onium Salt (PAG) |
| Fujifilm | Quencher Base - Tertiary Amine (n-Octylamine analog) (Lithography Grade) | Aliphatic Amine (Quencher) |
| Fujifilm | Base Quencher - Triphenylsulfonium Hydroxide analog (Lithography Grade) | Onium Base (Quencher) |
| Merck | Diazonaphthoquinone (DNQ) Sulfonate Ester - 2,1,4 isomer (Photoresist Grade) | Diazonaphthoquinone Sulfonate |
| Merck | Diazonaphthoquinone (DNQ) Sulfonate Ester - 2,1,5 isomer (Photoresist Grade) | Diazonaphthoquinone Sulfonate |
| JSR | Immersion Topcoat - Fluoropolymer based (Immersion Grade) | Immersion Lithography Topcoat |
| JSR | Immersion Topcoat - Self-Assembling Monolayer (SOM) type (Immersion Grade) | Self-Assembling Topcoat |
| DuPont | Photoresist Monomer - 4-Hydroxystyrene (4-HOST) (Polymerization Grade) | Styrenic Monomer |
| Nippon Soda | Photoresist Monomer - 2-Methyl-2-adamantyl methacrylate (MAdMA) (Polymerization Grade) | Methacrylate (Adamantyl) |
| Nippon Soda | Photoresist Monomer - gamma-Butyrolactone Methacrylate (GBLMA) (Polymerization Grade) | Methacrylate (Lactone-functional) |
| JSR | Chemically Amplified Resist (CAR) - KrF acrylate type (VLSI Grade) | Photoresist (Chemically Amplified) |
| JSR | Chemically Amplified Resist (CAR) - ArF methacrylate type (VLSI Grade) | Photoresist (Chemically Amplified DUV) |
| Stella Chemifa | Buffered Oxide Etch (BOE) 6:1 NH₄F:HF (Semiconductor Grade) | Buffered HF Etchant |
| Stella Chemifa | Buffered Oxide Etch (BOE) 10:1 NH₄F:HF (Semiconductor Grade) | Buffered HF Etchant (dilute) |
| Stella Chemifa | Dilute HF (DHF) 1:100 to 1:500 | Hydrofluoric Acid (Dilute) |
| Kanto Chemical | TMAH 25% (Tetramethylammonium Hydroxide) - Si Etch Grade (Semiconductor Grade) | Quaternary Ammonium Hydroxide |
| Kanto | TMAH 5-10% (Dilute Si Etch) (Semiconductor Grade) | Quaternary Ammonium Hydroxide (Dilute) |
| Kanto | TMAH + Triton X-100 (Surfactant-modified Si Etch) (MEMS Grade) | Quaternary Ammonium Hydroxide + Surfactant |
| Stella Chemifa | Titanium Etchant (HF only, dilute) (Semiconductor Grade) | Hydrofluoric Acid (Titanium) |
| Shin-Etsu Chemical | Hexamethyldisilazane (HMDS) | Silazane |
| Shin-Etsu | Hexamethyldisilazane (HMDS) (Electronic Grade) | Silazane |
| Fujimi | CMP Slurry (Ceria-based for STI Polishing) (Semiconductor Grade) | Colloidal Suspension (Rare Earth) |
| Fujimi | CMP Slurry (Colloidal Silica for Silicon Polishing) (Semiconductor Grade) | Colloidal Suspension |
| Nippon Shokubai | Lithium Bis(fluorosulfonyl)imide (LiFSI) (Battery Grade) | Lithium Imide Salt |
| Stella Chemifa | Lithium Tetrafluoroborate (LiBF4) (Battery Grade) | Lithium Fluoroborate |
| Ube Industries | Ethyl Methyl Carbonate (EMC) | Linear Carbonate |
| Ube Industries | Diethyl Carbonate (DEC) | Linear Carbonate |
| Atotech | Stress Reducer — Nickel Sulfamate Tetrahydrate (≥98%, Plating Salt) (Electroplating Grade) | Sulfamate Salt (Metal Salt) |
| Mitsubishi Gas Chemical | Inorganic Brightener — Selenium Dioxide (SeO2) for Nickel/Copper Alloys (Electroplating Grade) | Non-Metal Oxide (Chalcogen Oxide) |
| MKS Atotech | Immersion Gold Bath (for ENIG - replacement gold) | Immersion Gold Plating Bath |
| Sumitomo Bakelite | Epoxy Encapsulant (Transfer Molding Compound, EMC) | Encapsulant - Transfer Molding Compound |
| Namics | Liquid Epoxy Encapsulant (Dam-and-Fill, Underfill Grade) | Encapsulant - Liquid Epoxy |
| Namics | Capillary Underfill (CUF) for Flip-Chip/BGA | Underfill Material |
| Henkel | No-Flow Underfill (NUF) for Flip-Chip Assembly | No-Flow Underfill |
| Taiyo Ink | Liquid Photoimageable Solder Mask (LPI) - Screen Print Grade | Liquid Photoimageable Solder Mask (LPI) |
| Taiyo Ink | Liquid Photoimageable Solder Mask (LPI) - Spray/Curtain Coat Grade | Liquid Photoimageable Solder Mask (LPI) |
| Taiyo Ink | Solder Mask Thinner (for LPI Viscosity Adjustment) (PCB Grade) | Solder Mask Thinner |
| Taiyo Ink | Peelable Solder Mask (Temporary Protection) | Peelable Solder Mask / Temporary Solder Mask |
| Namics | Glob Top Encapsulant (Epoxy, Low CTE) | Glob Top Encapsulant |
| Namics | Molded Underfill (MUF) for 3D/TSV Packaging | Molded Underfill |
| Namics | Dam-and-Fill Underfill (for Large Die/CSP) | Dam-and-Fill Underfill |