Define the fabrication package
Keep the board revision, Gerber layers, outline, drill files and fabrication drawing consistent. Separate a bare-board order from assembly; an assembly quote also needs a BOM and placement data.
A practical manufacturing guide, backed by a dated view of Thailand’s PCB industry. Turn research into better questions, clearer specifications and better documented orders.
Keep the board revision, Gerber layers, outline, drill files and fabrication drawing consistent. Separate a bare-board order from assembly; an assembly quote also needs a BOM and placement data.
Ask the factory to propose the layer stack, dielectric thicknesses, finished copper and tolerances. List impedance targets with their reference layers and test method. The 3D workspace is a schematic aid; the agreed stackup is the production reference.
Record the exact grade and permitted alternatives. Compare electrical values at matching frequencies and test methods. Keep thermal requirements, surface finish and assembly conditions in the factory discussion.
Ask each supplier to list deviations, the manufacturing site, minimum order, production lead time and the complete quoted cost. Resolve the exceptions in the meeting room before the specification lines are locked.
Agree the required test reports, inspection records, samples, lot identification and acceptance criteria before signing. Decide who reviews each milestone and what happens if the delivered lot differs from the agreed specification.
Keep the original drawing fingerprint and agreed requirements with the contract. Revise the agreement before approving a substitution or new file revision. A matching package label identifies the reference; it does not certify the physical board.
Material references: Isola 370HR · Rogers RO4350B. Use the current manufacturer documentation with the specific construction and test conditions.
Operating sites and reported openings are separated from approved expansions. These are selected research profiles, not a complete registry, platform partnerships or verified available capacity. Confirm the exact legal entity, site and current capability before sourcing.
KCE lists PCB manufacturing at Lat Krabang and its KCE Technology site at Hi-Tech Industrial Estate. Its business includes automotive and other industrial electronics markets.
Company facility listing · undatedKCE · business and manufacturing facilities ↗The company describes its Thai business as manufacturing rigid double-sided and multilayer PCBs and lists a Samut Sakhon address.
Company facility listing · undatedApex Circuit · company website ↗BOI reported the plant opening on 16 December 2024 at Asia Industrial Estate (Suvarnabhumi), with multilayer PCB production starting that month. Confirm present capacity directly.
Opening reported · 2024-12-16BOI · Compeq factory opening ↗BOI reported approval of a second-phase investment for flexible PCBs. An approved expansion does not establish available production slots or a commissioning date.
Approval reported · 2026-05-18BOI / OSOS · phase-two approvals ↗BOI reported additional investment at Rojana Nong Yai for a multilayer and flexible PCB producer. Treat the new phase as expansion research pending direct confirmation.
Approval reported · 2026-05-18BOI / OSOS · phase-two approvals ↗BOI reported a second-phase investment at 304 Industrial Park, describing multilayer and HDI PCB technology. The report is investment evidence, not a live quotation.
Approval reported · 2026-05-18BOI / OSOS · phase-two approvals ↗Start with a reviewed brief. Use factory research to build a shortlist, then let actual offers and technical discussions establish the fit.