Semiconductor Packaging Materials made in Germany
85 curated semiconductor packaging materials products with Germany as country of origin, spanning 18 categories and 14 brands. Part of the MPBxChange global sourcing catalog.
Curated catalog of public products — not suppliers who have joined MPBx.
85
PRODUCTS
18
CATEGORIES
14
BRANDS
SEMICONDUCTOR PACKAGING MATERIALS · GERMANY · 85 PRODUCTS
| BRAND | PRODUCT | CATEGORY |
|---|---|---|
| Henkel | ABLESTIK 84-1LMISR4 | Die attach |
| Henkel | ABLESTIK 84-1LMIT1 | Die attach |
| Henkel | ABLESTIK 84-1LMIT | Die attach |
| Henkel | ABLESTIK 84-1LMI | Die attach |
| Henkel | ABLESTIK 8290 | Die attach |
| Henkel | ABLESTIK 8360 | Die attach |
| Henkel | ABLESTIK 849-TI | Die attach |
| Henkel | ABLESTIK ABP 6395T | Die attach |
| Henkel | ABLESTIK ABP 2030SCR | Die attach |
| Henkel | ABLESTIK ABP 8068TA | Die attach |
| Henkel | ABLESTIK ABP 8068TH | Die attach |
| Henkel | ABLESTIK ABP 8068TI | Die attach |
| Henkel | ABLESTIK ABP 8068TB | Die attach |
| Henkel | ABLESTIK ABP 8068TS | Die attach |
| Henkel | ABLESTIK SSP 2020 | Die attach |
| Henkel | ABLESTIK CDF 200 | Die attach |
| Henkel | ABLESTIK ATB 125GR | Die attach |
| Henkel | ABLESTIK ATB 100GR | Die attach |
| Henkel | ABLESTIK ATB 100HS | Die attach |
| Henkel | ABLESTIK ATB F100E | Die attach |
| Henkel | ABLESTIK NCF 218 | Die attach |
| Heraeus | mAgic PE338 | Die attach |
| Heraeus | mAgic PE360 | Die attach |
| Heraeus | mAgic DA295 A | Die attach |
| Henkel | GR9810-1PLA | Encapsulant / molding |
| Henkel | GR350HT | Encapsulant / molding |
| Henkel | GR60HT | Encapsulant / molding |
| Henkel | GR730HT | Encapsulant / molding |
| Henkel | GR30HT | Encapsulant / molding |
| Henkel | LCM 1000AG-1 | Encapsulant / molding |
| Henkel | LCM 1000AF | Encapsulant / molding |
| Henkel | FP4526 | Encapsulant / molding |
| Henkel | FP4530 | Encapsulant / molding |
| Henkel | FP4531 | Encapsulant / molding |
| Henkel | FP4549 | Encapsulant / molding |
| Henkel | E 1172 A | Encapsulant / molding |
| Henkel | E 1216M | Encapsulant / molding |
| Henkel | 3563 | Encapsulant / molding |
| Henkel | NCP 8209 | Encapsulant / molding |
| Henkel | FP 8201 | Encapsulant / molding |
| Henkel | NCP 5209 | Encapsulant / molding |
| Henkel | EO1016 | Encapsulant / molding |
| Henkel | EO1060 | Encapsulant / molding |
| Henkel | EO1080 | Encapsulant / molding |
| Henkel | FP4451 | Encapsulant / molding |
| Henkel | FP4450 | Encapsulant / molding |
| Henkel | FP4450HF | Encapsulant / molding |
| CeramTec | AlN | Ceramic substrate |
| CeramTec | Si3N4 | Ceramic substrate |
| Heraeus | LTCC | Ceramic substrate |
| Heraeus | LTCC | Ceramic substrate |
| Heraeus | LTCC | Ceramic substrate |
| SCHOTT | Glass | Ceramic substrate |
| SCHOTT | Glass | Ceramic substrate |
| SCHOTT | Glass | Ceramic substrate |
| SCHOTT | D263 TGV | Advanced packaging |
| SCHOTT | AF32 eco TGV | Advanced packaging |
| CoolLaboratory | Gallium-Indium | Thermal interface |
| Henkel | Conductive Resin | EMI / functional |
| Henkel | Nickel Conductive Paint | EMI / functional |
| BASF | Methanesulfonic Acid | Organic Sulfonic Acid |
| Heraeus | Palladium(II) Chloride | Metal Salt (Plating) |
| Heraeus | Sodium Tetrachloropalladate(II) | Metal Salt (Plating) |
| Atotech | Tin Methanesulfonate | Metal Salt (Plating) |
| Atotech | Copper Methanesulfonate | Metal Salt (Plating) |
| Atotech | Copper Methanesulfonate | Metal Salt (Plating) |
| Enthone | Electroless Nickel Plating Solution (Low Phosphorus) | Electroless Plating Chemical |
| Atotech | Electroless Nickel Plating Solution (High Phosphorus) | Electroless Plating Chemical |
| Coventya | Electroless Nickel Plating Solution (DMAB-Reduced) | Electroless Plating Chemical |
| Atotech | Electroless Palladium Plating Solution (ENEPIG Palladium Grade) | Electroless Plating Chemical |
| Coventya | Electroless Cobalt Plating Solution | Electroless Plating Chemical |
| Atotech | Electroless Nickel-Phosphorus (5-7% P) — Medium Phosphorus (Semiconductor) | Electroless Plating Chemical |
| Atotech | Electroless Nickel-Phosphorus (9-12% P) — High Phosphorus (Semiconductor Grade) | Electroless Plating Chemical |
| BASF | Dimethylamine Borane (DMAB) | Electroless Plating Chemical (Reducing Agent) |
| BASF | Glyoxylic Acid | Electroless Plating Chemical (Reducing Agent) |
| BASF | N-Methyl-2-Pyrrolidone (NMP) — Semiconductor/SEMI Grade (99.99%) | Cyclic Amide (Lactam) |
| Petrofer | Modified Alcohol — Biesterfield/Polar Cleaner Grade (for Vacuum Process) | Modified Alcohol Solvent — Oxygenated |
| Evonik | Foam Control Agent — Polyether Modified Siloxane (Non-Silicone Emission for Critical Plating) | Polyether-Modified Siloxane |
| Aixtron | AIX G5+ C, AIX G5 C, AIX G5 HT | CVD |
| Aixtron | AIX G5+ C, AIX G10-AsP | Epitaxy |
| RENA Technologies | Infinity, Inception, FC-3100 style | Wet Etch |
| RENA Technologies | Inception | Wet Etch |
| SUSS MicroTec | ACS200 Gen3 | Photoresist Coater/Developer |
| SUSS MicroTec | ACS300 Gen2 | Photoresist Coater/Developer |
| SUSS MicroTec | Spin coaters, spray coaters | Photoresist Coater |