Semiconductor Packaging Materials made in USA
272 curated semiconductor packaging materials products with USA as country of origin, spanning 129 categories and 55 brands. Part of the MPBxChange global sourcing catalog.
Curated catalog of public products — not suppliers who have joined MPBx.
272
PRODUCTS
129
CATEGORIES
55
BRANDS
SEMICONDUCTOR PACKAGING MATERIALS · USA · 272 PRODUCTS
| BRAND | PRODUCT | CATEGORY |
|---|---|---|
| AI Technology | ME8456 | Die attach |
| AI Technology | ME8456-00 | Die attach |
| AI Technology | ME8512 | Die attach |
| AI Technology | MC8880 | Die attach |
| AI Technology | ESP7660-HK-DAF | Die attach |
| AI Technology | ESP7666-HK-DAF | Die attach |
| AI Technology | ESP8660-HK-DAF | Die attach |
| United Adhesives | Eposolder 6537 | Die attach |
| CoorsTek | Al2O3 | Ceramic substrate |
| CoorsTek | Al2O3 | Ceramic substrate |
| Corning | Glass | Ceramic substrate |
| Dow | CYCLOTENE 3022 | WLP material |
| Dow | CYCLOTENE 4022 | WLP material |
| Dow | CYCLOTENE AD-BCB | WLP material |
| Lam Research | ULK PECVD | Advanced packaging |
| Intel | Air Gap | Advanced packaging |
| Corning | Glass Interposer | Advanced packaging |
| Dow | CYCLOTENE 3022 | Advanced packaging |
| Dow | CYCLOTENE 4022 | Advanced packaging |
| Honeywell | PTM7950 | Thermal interface |
| Honeywell | PTM7900 | Thermal interface |
| Honeywell | PTM6000 | Thermal interface |
| Honeywell | PSM | Thermal interface |
| Dow | SRX-06HB | EMI / functional |
| Dow | SRX-06HV | EMI / functional |
| Dow | SRX-08HB | EMI / functional |
| Dow | SRR-016HM | EMI / functional |
| Dow | SR-25CP | EMI / functional |
| Dow | SR-25CP+ | EMI / functional |
| Dow | SR-25CP-H | EMI / functional |
| Dow | SR-25CP-V | EMI / functional |
| Dow | SR-4HFFN | EMI / functional |
| Dow | HD-SR02L | EMI / functional |
| Dow | Hybrid Shielding | EMI / functional |
| Dow | HD-SR01 | EMI / functional |
| Dow | Hybrid Ag+Cu | EMI / functional |
| Dow | SNC-02 | EMI / functional |
| Dow | SNC-06 | EMI / functional |
| Dow | CR-3S02 | EMI / functional |
| Dow | CR-3S10 | EMI / functional |
| Dow | HD-5S04 | EMI / functional |
| Dow | LSR1890B | EMI / functional |
| Parker Chomerics | Aerosol Spray Shield | EMI / functional |
| Parker Chomerics | Aerosol Shield Ni | EMI / functional |
| Parker Chomerics | CHO-SHIELD 2000 | EMI / functional |
| Parker Chomerics | CHO-SHIELD 2003 | EMI / functional |
| PPG Industries | ECE 101 | EMI / functional |
| PPG Industries | ECE 118Cu | EMI / functional |
| BASF | Sulfuric Acid | Strong Mineral Acid |
| Kanto Chemical | Hydrochloric Acid | Strong Mineral Acid |
| Kanto Chemical | Nitric Acid | Strong Mineral Acid (Oxidizing) |
| Kanto Chemical | Phosphoric Acid | Medium-Strength Mineral Acid |
| BASF | Acetic Acid | Organic Carboxylic Acid |
| Kanto Chemical | Sodium Hydroxide | Strong Base (Alkali Hydroxide) |
| Kanto Chemical | Potassium Hydroxide | Strong Base (Alkali Hydroxide) |
| Kanto Chemical | Ammonium Hydroxide (Aqua Ammonia) | Weak Base (Aqueous Ammonia) |
| Solvay | Sodium Carbonate (Soda Ash) | Alkali Salt (Carbonate) |
| Armand Products | Potassium Carbonate | Alkali Salt (Carbonate) |
| PQ Corporation | Sodium Silicate (Water Glass) | Alkali Silicate |
| Dow | Monoethanolamine (MEA) | Alkanolamine (Organic Base) |
| Air Liquide | Ammonia Solution (Anhydrous Ammonia precursor) | Alkali Gas (Aqueous Solution) |
| Thermo Fisher | Silver Nitrate | Metal Salt (Plating) |
| BASF | Dimethylamine Borane (DMAB) | Electroless Plating Chemical (Reducing Agent) |
| Sigma-Aldrich | Sodium Borohydride | Electroless Plating Chemical (Reducing Agent) |
| Sigma-Aldrich | Ethylenediaminetetraacetic Acid (EDTA) | Electroless Plating Chemical (Complexing Agent) |
| BASF | Sulfuric Acid | Electroless Plating Chemical (Accelerator / pH Adjuster) |
| UNID | Potassium Hydroxide (Caustic Potash) | Electroless Plating Chemical (pH Adjuster) |
| Sigma-Aldrich | Stannous Chloride Anhydrous | Metal Salt (Plating) |
| Sigma-Aldrich | Boric Acid | Electroless Plating Chemical (Buffer / pH Adjuster) |
| DuPont | Positive Photoresist g-line (AZ 1512) (Semiconductor Grade) | Photoresist (Novolac/DNQ) |
| DuPont | Positive Photoresist i-line (AZ 5214) (Semiconductor Grade) | Photoresist (Novolac/DNQ) |
| DuPont | Photoresist Developer TMAH 0.26N (2.4%) (Semiconductor Grade) | Quaternary Ammonium Hydroxide |
| DuPont | Edge Bead Remover (EBR) - PGMEA based (Semiconductor Grade) | Glycol Ether Ester |
| DuPont | Edge Bead Remover (EBR) - n-Butyl Acetate (Semiconductor Grade) | Ester |
| Merck | HMDS Hexamethyldisilazane (Semiconductor Grade) | Silazane (Organosilicon) |
| Merck | HMDS Hexamethyldisilazane (Vapor Prime Grade) (VLSI Grade) | Silazane (Organosilicon) |
| BASF | Sulfuric Peroxide Mixture (SPM) - 3:1 (Semiconductor Grade) | Acid Oxidizer Mixture |
| Merck | Adhesion Promoter - HMDS Vapor Prime (conventional) (Semiconductor Grade) | Silazane |
| DuPont (AZ 1300 | Novolak Photoresist (general purpose g-line) (Semiconductor Grade) | Photoresist (Novolac/DNQ) |
| DuPont (Cyclotene 3000 | Permanent Photoresist - Benzocyclobutene (BCB) based (Wafer Grade) | Permanent Photoresist (BCB) |
| BASF | Nitric Acid Etchant 40-65% (for Ag, Cu specialty) (Industrial Grade) | Mineral Acid (Oxidizing) |
| BASF | Nitric Acid 68-70% (Concentrated, Semiconductor Grade) | Mineral Acid (Oxidizing) |
| BASF | SPM (Sulfuric Peroxide Mixture) 3:1 - Semiconductor Grade (VLSI Grade) | Acid Oxidizer Mixture |
| Avantor | Potassium Hydroxide Etchant 30-45% (KOH) (Semiconductor Grade) | Strong Base (Alkali Hydroxide) |
| Transene | Aluminum Etchant (Phosphoric/Nitric/Acetic - PAN) (Semiconductor Grade) | Mixed Acid Etchant (Aluminum) |
| Transene | Aluminum Etchant Type A (Transene) (Semiconductor Grade) | Mixed Acid Etchant (Aluminum) |
| BASF | Aluminum Etchant - KOH-based (for Al foils, non-semiconductor) (Industrial Grade) | Strong Base (Aluminum etch) |
| Transene | Gold Etchant - KI/I₂ based (standard) (Semiconductor Grade) | Halogen/Iodide Etchant (Gold) |
| Transene | Silver Etchant (Ferric Nitrate based) (Semiconductor Grade) | Metal Nitrate Etchant (Silver) |
| Transene | Titanium Etchant (HF/Nitric blend) (Semiconductor Grade) | HF/Nitric Acid Etchant (Titanium) |
| Transene | Tungsten Etchant (Peroxide-based) (Semiconductor Grade) | Peroxide/Acid Etchant (Tungsten) |
| BASF | Isopropyl Alcohol | Aliphatic Alcohol |
| BASF | Acetone | Ketone |
| BASF | N-Methyl-2-Pyrrolidone | Lactam/Solvent |
| Dow Chemical | Propylene Glycol Monomethyl Ether Acetate | Glycol Ether Ester |
| Dow | Propylene Glycol Monomethyl Ether | Glycol Ether |
| Gaylord Chemical | Dimethyl Sulfoxide (Electronic Grade) | Sulfoxide |
| Cargill | Ethanol (Absolute) | Aliphatic Alcohol |
| ExxonMobil | Toluene | Aromatic Hydrocarbon |
| ExxonMobil | Xylene (mixed isomers) | Aromatic Hydrocarbon |
| Eastman | 2-Heptanone (Methyl n-Amyl Ketone) | Aliphatic Ketone |
| Celanese | 4-Methyl-2-Pentanone (MIBK) | Aliphatic Ketone |
| BASF | gamma-Butyrolactone (GBL) (Electronic Grade) | Lactone |
| BASF | Propylene Carbonate (Electronic Grade) | Cyclic Carbonate |
| Dow | Diethylene Glycol Monomethyl Ether (Electronic Grade) | Glycol Ether |
| Dow | Ethylene Glycol Monomethyl Ether (Technical Grade) | Glycol Ether |
| BASF | Tetrahydrofuran (THF) | Cyclic Ether |
| MilliporeSigma | Deionized Water (DI Water) Type I | Inorganic Oxide |
| Solvay | Hydrogen Peroxide 30% (Technical Grade) | Peroxide |
| Solvay | Hydrogen Peroxide 50% (Semiconductor Grade SEMI G3) | Peroxide |
| BASF | Copper Sulfate Pentahydrate (Semiconductor Grade) | Copper Salt |
| BASF | Sodium Hydroxide (Caustic Soda) Pellets | Alkali Metal Hydroxide |
| BASF | Aqueous Alkaline Cleaner — Semiconductor Grade (Ammonium Hydroxide Based) (Semiconductor/SEMI Grade) | Aqueous Alkaline Cleaner |
| BASF | Isopropyl Alcohol (IPA) — 99.9% Semiconductor/SEMI Grade (C1) | Aliphatic Alcohol |
| BASF | Acetone — SEMI Grade (C1, Semiconductor Photoresist Developer Rinse) | Ketone |
| Gaylord Chemical | Dimethyl Sulfoxide (DMSO) — Semiconductor/SEMI Grade (≥99.999%) | Sulfoxide |
| Dow | Ethylene Glycol — Inhibited/Heat Transfer Grade (with Corrosion Inhibitors) | Diol (Glycol) — Inhibited |
| Dow | Propylene Glycol Monomethyl Ether (PGME/PM) — Electronics Grade (≥99.5%) | Glycol Ether |
| Dow | Propylene Glycol Monomethyl Ether (PGME/PM) — SEMI Grade (≥99.99%) | Glycol Ether |
| Dow | Propylene Glycol Monomethyl Ether Acetate (PGMEA) — Semiconductor Grade (≥99.5%) | Glycol Ether Ester |
| 3M | HFE-7200 / Novec 7200 — Ethyl Nonafluorobutyl Ether (≥99.5%) | Hydrofluoroether (HFE) |
| 3M | Fluorinated Surfactant — Perfluoroalkyl Betaine (low ppb metal grade) | Fluorinated Surfactant (Anionic/Zwitterionic) |
| Entegris | Ultrasonic Cleaning Solution — Neutral pH Semiconductor Grade | Formulated Ultrasonic Cleaning Solution |
| BASF | SC-1 Clean Solution — NH4OH:H2O2:H2O (1:1:5 ratio, Standard RCA) | RCA Standard Clean — Oxidizing Alkaline |
| BASF | SC-2 Clean Solution — HCl:H2O2:H2O (1:1:6 ratio, Standard RCA) | RCA Standard Clean — Oxidizing Acidic |
| BASF | Piranha Solution — Standard (H2SO4:H2O2, 3:1 to 7:1 v/v) | Strong Oxidizing Acid Mixture |
| BASF | Piranha Solution — Sulfuric/Peroxide Mixture (SPM, 4:1 ratio) | Strong Oxidizing Acid Mixture (SPM — Sulfuric Peroxide Mixture) |
| 3M | Rinse Aid — Fluorinated Non-Ionic (Ultra-Low Surface Tension) | Fluorinated Rinse Aid |
| BASF | Piranha Solution — RCA Standard (H2SO4:H2O2, 3:1, Photoresist Strip) | Strong Oxidizing Acid Mixture (RCA Standard) |
| BASF | N-Methyl-2-Pyrrolidone (NMP) — Photoresist Stripper Formulation (with Amine Additives) | Amine-Enhanced NMP Stripper |
| Dymax | Epoxy Conformal Coating (UV-Curable, Cationic) | UV-Curable Epoxy Conformal Coating |
| DuPont | Dry Film Solder Mask (DFSM) for High-Density Boards | Dry Film Solder Mask |
| Applied Materials | Endura 5500, Endura 2, Endura HT | PVD |
| Lam Research | Altus, Vector PVD | PVD |
| Veeco (CVC) | Explorer, Benchmark | PVD |
| Applied Materials | Endura iPVD | PVD |
| Applied Materials | Endura II, Endura TXZ | PVD |
| Applied Materials | Producer GT, Producer SE, Producer C | CVD |
| Lam Research | Vector Express, Vector Excel, Vector Extreme | CVD |
| Applied Materials | Producer HARP | CVD |
| Applied Materials | Producer BPSG, Producer TEOS | CVD |
| Veeco | K465i, MaxBright M, MaxBright MHP, EPIK 700 | CVD |
| Veeco | Propel, Propel HVM, Propel 300mm | CVD |
| Applied Materials | Olympia ALD, Centura ALD | ALD |
| Lam Research | Vector ALD, Altus ALD | ALD |
| Applied Materials | Raider ECD, Endura ECD, Sabre 3D | ECD |
| Lam Research | SABRE 3D, Triton ECD | ECD |
| Applied Materials | Nokota ECD (300mm panel) | ECD |
| Veeco | Propel HVM, Propel 300mm, K465i | Epitaxy |
| Veeco (RIBER) | GEN200, GEN930, K475 | Epitaxy |
| Applied Materials | Centura Epi, Epi XP | Epitaxy |
| Lam Research | 2300 Flex Series (D,E,F,G,H), Exelan Flex | Dry Etch |
| Lam Research | 2300 Kiyo Series (C,E,F,G), Versys Kiyo45 | Dry Etch |
| Applied Materials | Centura DPS II, Centura AdvantEdge, Producer Etch | Dry Etch |
| Lam Research | 2300 Versys Metal (L,M,N series) | Dry Etch |
| Lam Research | 2300 Syndion, Syndion-C | Dry Etch |
| Lam Research | 2300 Selis | Dry Etch |
| Lam Research | Flex ALE (AMMP), Kiyo ALE | ALE |
| Applied Materials | Centura ALE, Producer ALE | ALE |
| Applied Materials | Reflexion LK, Reflexion GT, Reflexion GTC | CMP Polishing |
| Applied Materials | Reflexion GTC | CMP Polishing |
| Kinetics (KLA) | iSurf, 3200M | CMP Polishing |
| Lam Research | DV-Prime, Da Vinci, EOS | CMP Cleaning |
| Lam Research | Da Vinci, DV-Prime, EOS, SP Series | Single Wafer Clean |
| Lam Research | GAMMA Series (GAMMA 2100, 3100) | Resist Strip |
| Lam Research | SP Series, Da Vinci | Resist Strip |
| Applied Materials | Vantage Radiance, Vantage RadOx, Vantage Vulcan | RTP |
| Applied Materials | Vantage Astra, Vantage Astra DLA | RTP |
| Applied Materials | Radiance Centura | RTP |
| Coherent (Applied Materials) | Vantage Astra DLA | Laser Anneal |
| Applied Materials | Centura Epi, Epi XP, RP Epi | Epitaxy |
| Applied Materials | VIISta Trident, VIISta HCP, VIISta HCR | High Current |
| Axcelis | Purion H6, Purion H, Purion H200, Purion Dragon | High Current |
| Applied Materials | VIISta 900XP, Swift | Medium Current |
| Axcelis | Purion M, Purion M+ SiC | Medium Current |
| Axcelis | Purion XE, EXE, VXE, XEmax | High Energy |
| Applied Materials | VIISta 3000XP, VIISta MeV Light Ion | High Energy |
| Applied Materials | VIISta PLAD, VIISta PLAD HT | Plasma Doping |
| Axcelis | Purion XE Power Series+ | MeV Implanter |
| Applied Materials | VIISta MeV Light Ion | MeV Implanter |
| Axcelis | Purion H200+ SiC, Purion M+ SiC, XE+ SiC | Specialty |
| KLA | 3935, 3920 EP | Bright-Field |
| KLA | 2965, 2950 EP | Bright-Field |
| KLA | 2930 Series (2935) | Bright-Field |
| KLA | 2800, 283x Series | Bright-Field |
| KLA | 8920 | Bright-Field |
| KLA | Voyager 1015 | Bright-Field |
| KLA | Puma 9980 | Dark-Field |
| KLA | Puma 9150, 9130, 9110 | Dark-Field |
| KLA | Multi-mode | Dark-Field |
| KLA | Surfscan SP7 | Unpatterned |
| KLA | Surfscan SP5XP | Unpatterned |
| KLA | Surfscan SP3 | Unpatterned |
| KLA | Surfscan SP1, SP2 | Unpatterned |
| KLA | eSL10 | Single-Beam |
| Applied Materials | PROVision | Single-Beam |
| KLA | PROVision X10 | Multi-Beam |
| Applied Materials | eVision Hybrid | Hybrid |
| Applied Materials | VeritySEM 10 | High-Resolution |
| KLA | Archer 750, Archer 600 | DBO/Scatterometry |
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