Semiconductor Packaging Materials made in Japan
210 curated semiconductor packaging materials products with Japan as country of origin, spanning 63 categories and 43 brands. Part of the MPBxChange global sourcing catalog.
Curated catalog of public products — not suppliers who have joined MPBx.
210
PRODUCTS
63
CATEGORIES
43
BRANDS
SEMICONDUCTOR PACKAGING MATERIALS · JAPAN · 210 PRODUCTS
| BRAND | PRODUCT | CATEGORY |
|---|---|---|
| Namics | H9892-5 | Die attach |
| Namics | H9888-2 | Die attach |
| Namics | H9890-6A | Die attach |
| Namics | H9890-10A | Die attach |
| Namics | H9890-11 | Die attach |
| Kyocera | Ag Sinter Paste | Die attach |
| Resonac | Cu Sinter Paste | Die attach |
| Namics | H9890-7 | Die attach |
| Sumitomo Bakelite | EME-G700 | Encapsulant / molding |
| Sumitomo Bakelite | EME-G700LA | Encapsulant / molding |
| Sumitomo Bakelite | EME-G770 | Encapsulant / molding |
| Sumitomo Bakelite | EME-G750 | Encapsulant / molding |
| Sumitomo Bakelite | EME-G760 | Encapsulant / molding |
| Sumitomo Bakelite | EME-G790 | Encapsulant / molding |
| Resonac | CEL-9240 ZHF10HT3W | Encapsulant / molding |
| Resonac | CEL-9240 HF10 | Encapsulant / molding |
| Resonac | CEL-8240 HF10 | Encapsulant / molding |
| Resonac | CEL-9200 HF10 | Encapsulant / molding |
| Resonac | CEL-9200 HF9 | Encapsulant / molding |
| Resonac | CEL-9220 HF10 | Encapsulant / molding |
| Kyocera | KE-G1250 | Encapsulant / molding |
| Kyocera | KE-G2250 | Encapsulant / molding |
| Kyocera | KE-G2270 | Encapsulant / molding |
| Kyocera | KE-G6000DA | Encapsulant / molding |
| Panasonic | CV8511CUB | Encapsulant / molding |
| Panasonic | X85U-PT1-AP | Encapsulant / molding |
| Panasonic | CV8581MUW | Encapsulant / molding |
| Panasonic | CV8713UB | Encapsulant / molding |
| Panasonic | CV8714AHSL | Encapsulant / molding |
| Panasonic | X8770UY | Encapsulant / molding |
| Kyocera | KE-G1250FC | Encapsulant / molding |
| Namics | U8443-14 | Encapsulant / molding |
| Namics | U8410-73C | Encapsulant / molding |
| Namics | U8410-73CF3 | Encapsulant / molding |
| Namics | U8410-99 | Encapsulant / molding |
| Namics | U8410-302 | Encapsulant / molding |
| Namics | U8410-377 | Encapsulant / molding |
| Namics | U8439-1 | Encapsulant / molding |
| Namics | U8439-105 | Encapsulant / molding |
| Panasonic | CV5797U | Encapsulant / molding |
| Resonac | MCL-E-679FG Type R | Organic substrate |
| Resonac | MCL-E-679FG Type S | Organic substrate |
| Resonac | MCL-E-700G Type R | Organic substrate |
| Resonac | MCL-E-705G | Organic substrate |
| Resonac | MCL-E-770G | Organic substrate |
| Panasonic | Megtron 6 R-5775K | Organic substrate |
| Panasonic | Megtron 7 R-5785(N) | Organic substrate |
| Panasonic | Megtron 7 R-5785(GN) | Organic substrate |
| Resonac | GEA-700G | Organic substrate |
| AGC | ALX | Organic substrate |
| Kyocera | Al2O3 | Ceramic substrate |
| Kyocera | Al2O3 | Ceramic substrate |
| Maruwa | Al2O3 | Ceramic substrate |
| Kyocera | Al2O3 | Ceramic substrate |
| Kyocera | Al2O3 | Ceramic substrate |
| Maruwa | Al2O3 | Ceramic substrate |
| Kyocera | AlN | Ceramic substrate |
| Kyocera | AlN | Ceramic substrate |
| Kyocera | AlN | Ceramic substrate |
| Kyocera | AlN | Ceramic substrate |
| Matsuo Sangyo | AlN | Ceramic substrate |
| Matsuo Sangyo | AlN | Ceramic substrate |
| Matsuo Sangyo | AlN | Ceramic substrate |
| Toshiba Materials | Si3N4 | Ceramic substrate |
| Kyocera | Si3N4 | Ceramic substrate |
| Ferrotec | Si3N4 | Ceramic substrate |
| Kyocera | SiC | Ceramic substrate |
| Kyocera | HTCC | Ceramic substrate |
| AGC | Glass | Ceramic substrate |
| TOK | TMMF-S2000 | WLP material |
| TOK | TMMR P-W1000T PM | WLP material |
| TOK | PMER P-BK | WLP material |
| TOK | PMER P-CS | WLP material |
| TOK | PMER P-WT | WLP material |
| JSR | THB-111N | WLP material |
| JSR | THB-126N | WLP material |
| JSR | THB-151N | WLP material |
| JSR | WPR Series | WLP material |
| JSR | FG Series | WLP material |
| AGC | EN-A1 TGV | Advanced packaging |
| JSR | THB-111N | Advanced packaging |
| Resonac | UF-3001A | Advanced packaging |
| Resonac | Xlmega Cap 3003 | Advanced packaging |
| Resonac | Xlmega Non-Flow 3002 | Advanced packaging |
| Dexerials | HY-P1 | Thermal interface |
| Dexerials | HY-P2 | Thermal interface |
| Dexerials | HY-21 | Thermal interface |
| Dexerials | N-Del Series | Thermal interface |
| Dexerials | EX-20000ND | Thermal interface |
| Dexerials | EX-25010N | Thermal interface |
| Dexerials | HC-DS Series | Thermal interface |
| Dexerials | NM-RT25H | Thermal interface |
| Dexerials | NM-RT15 | Thermal interface |
| Namics | H9890-5 | Thermal interface |
| Namics | H9890-7 | Thermal interface |
| Fujipoly | HTC1000 | Thermal interface |
| Fujipoly | HTC2000 | Thermal interface |
| Panasonic | GS200 | Thermal interface |
| Panasonic | GS500 | Thermal interface |
| Panasonic | GS700 | Thermal interface |
| Panasonic | GS1000 | Thermal interface |
| Panasonic | GS1500 | Thermal interface |
| Dexerials | InS Sheet | Thermal interface |
| Dexerials | InS Metal TIM | Thermal interface |
| Fujipoly | TCA2500 | Thermal interface |
| Fujipoly | TCA3500 | Thermal interface |
| Resonac | P-SL150HF | EMI / functional |
| Dexerials | SCV-02D | EMI / functional |
| Dexerials | SCV-06C | EMI / functional |
| Dexerials | SCV-06A | EMI / functional |
| Dexerials | STAF Tapes | EMI / functional |
| Stella Chemifa | Hydrofluoric Acid | Weak Mineral Acid (Highly Corrosive/Toxic) |
| Kanto Chemical | Hydrofluoric Acid | Weak Mineral Acid (Highly Corrosive/Toxic) |
| Stella Chemifa | Fluoroboric Acid | Fluorinated Mineral Acid |
| Tokyo Ohka Kogyo | Tetramethylammonium Hydroxide (TMAH) | Quaternary Ammonium Hydroxide (Organic Base) |
| TOK | Tetramethylammonium Hydroxide (TMAH) | Quaternary Ammonium Hydroxide (Organic Base) |
| BASF Electronic Materials | Copper Sulfate Pentahydrate | Metal Salt (Plating) |
| Stella Chemifa | Copper Sulfate Anhydrous | Metal Salt (Plating) |
| Stella Chemifa | Nickel Sulfate Hexahydrate | Metal Salt (Plating) |
| Stella Chemifa | Nickel Chloride Hexahydrate | Metal Salt (Plating) |
| Showa Chemical | Tin Sulfate | Metal Salt (Plating) |
| Stella Chemifa | Copper Pyrophosphate | Metal Salt (Plating) |
| Stella Chemifa | Cobalt(II) Sulfate Heptahydrate | Metal Salt (Plating) |
| Uyemura | Immersion Gold Plating Solution (Displacement Gold) (ENIG / ENEPIG Gold Grade) | Electroless Plating Chemical |
| Stella Chemifa | Sodium Hypophosphite Monohydrate | Electroless Plating Chemical (Reducing Agent) |
| Sigma-Aldrich | Potassium Iodide | Electroless Plating Chemical (Stabilizer) |
| Honeywell | Sodium Hydroxide | Electroless Plating Chemical (pH Adjuster) |
| Kanto Chemical | Ammonium Hydroxide | Electroless Plating Chemical (pH Adjuster / Complexant) |
| JSR Micro | Positive Photoresist ArF (Immersion 193nm) - CAR type (VLSI Grade) | Photoresist (Chemically Amplified DUV) |
| Stella Chemifa | Buffered Oxide Etch (BOE) 6:1 NH₄F:HF (Semiconductor Grade) | Buffered HF Etchant |
| Shin-Etsu Chemical | Hexamethyldisilazane (HMDS) | Silazane |
| Fujimi | CMP Slurry (Colloidal Silica for Silicon Polishing) (Semiconductor Grade) | Colloidal Suspension |
| Sumitomo Bakelite | Epoxy Encapsulant (Transfer Molding Compound, EMC) | Encapsulant - Transfer Molding Compound |
| TEL | EXIM PVD | PVD |
| TEL | TELINDY PLUS, ALPHA-8SE, EVAROS | CVD |
| TEL | Probus-SiC, Triase+ EX-II | CVD |
| TEL | NT333 ALD, TELINDY PLUS IRad | ALD |
| Ebara | ECD 570, ECD 580 | ECD |
| TEL | Probus-SiC | Epitaxy |
| TEL | Tactras Vigus, Tactras Vesta, Tactras DRM | Dry Etch |
| Hitachi High-Tech (Ebara) | M-700V, M-800A | Dry Etch |
| Dainippon Screen (DNS) | FC-3100, WS-820C, WS-620C | Wet Etch |
| TEL | EXPEDIUS-i, EXPEDIUS+ | Wet Etch |
| TEL | CELLESTA-i, CELLESTA-i MD | Wet Etch |
| Tokyo Electron | Tactras SCCM ALE | ALE |
| Nikon | NSR-S635E, NSR-S630E, NSR-S622D | DUV Scanner |
| Canon | FPA-5510iX, FPA-3030EX6, FPA-3030EX8 | DUV Scanner |
| IMS (Intel+Mupe) | Multi-Beam Writer | E-beam |
| Canon | FPA-1200NZ2C | Nanoimprint |
| Nikon | NSR-S220D, NSR-S535C | DUV Scanner |
| Ebara | F-REX300X, F-REX300XA, F-REX200M2 | CMP Polishing |
| Tokyo Seimitsu (ACCRETECH) | PG-3000RMX, PG-3000RVX, PG-2000RMX | CMP Polishing |
| Ebara | BevelPol | CMP Polishing |
| TEL | CELLESTA-i, CELLESTA-i MD | Single Wafer Clean |
| TEL | NS300Z, NS300+ HT, NS300+ 200mm | Single Wafer Clean |
| Dainippon Screen (DNS) | SU-3400, SU-3300, SU-3200 | Single Wafer Clean |
| TEL | ANTARES-Nano, ANTARES | Single Wafer Clean |
| Dainippon Screen (DNS) | FC-3100, WS-820C, WS-620C, CW-2000 | Batch Wet Bench |
| TEL | EXPEDIUS-i, EXPEDIUS+ | Batch Wet Bench |
| TEL | Trias SPAi, Tactras RLSA | Resist Strip |
| TEL | TELINDY PLUS, EVAROS, TELFORMULA, ALPHA-8SE | Vertical Furnace |
| TEL | TELINDY PLUS IRad | Vertical Furnace |
| Screen (DNS) | LA-3100 | Laser Anneal |
| TEL | TELINDY PLUS, ALPHA-8SE, EVAROS | Vertical Furnace |
| TEL | CLEAN TRACK LITHIUS Pro Z, LITHIUS Pro DICE | Coater/Developer |
| TEL | LITHIUS Pro V, LITHIUS Pro, ACT12 | Coater/Developer |
| TEL | ACT12, ACT8, Mark 7, Mark 8 | Coater/Developer |
| SCREEN (DNS) | DT-3000 SOKUDO DUO, RF-300EX, SK-80EX | Coater/Developer |
| Hitachi High-Tech | LS9300AD | Low-Voltage |
| Hitachi High-Tech | CG7300 / CG7400 | High-Resolution |
| Hitachi High-Tech | GT2000 | High-Resolution |
| Hitachi High-Tech | CG6300 | Mid-Range |
| Hitachi High-Tech | CS5000 | Mid-Range |
| Hitachi High-Tech | SU5000 | Research/Lab |
| Hitachi High-Tech | CV7300 | High-Voltage |
| Advantest | V93000 EXA Scale, PS5000 | SoC/Logic |
| Advantest | T2000, T2000 AiR2X | SoC/Logic |
| Advantest | T5835 | Memory |
| Advantest | T5830/T5830ES | Memory |
| Advantest | T5833/T5833ES | Memory |
| Advantest | T5851/T5851ES | Memory |
| Advantest | T5503HS2 | Memory |
| Advantest | T5230 | Memory |
| Advantest | B6700 Series | Memory |
| Advantest | V93000 Wave Scale mmWave | RF |
| Advantest | V93000 Wave Scale RF | RF |
| Advantest | EVA100 | Analog |
| Advantest | B6700 Series | Dynamic Burn-in |
| ESPEC | EHS-212M, EHS-432MA | HAST |
| Advantest | M4841 | Dynamic |
| DISCO | DAD3240 | Blade Dicing Saw |
| DISCO | DAD3350 | Blade Dicing Saw |
| DISCO | DAD3220/3230/3430 | Blade Dicing Saw |
| DISCO | DFG series + grinder combo | DBG System |
| Shinkawa | APD series (Various) | Die Bonder |
| Shinkawa | UTC-5000 Super | Wedge Bonder |
| Shinkawa | UTC-5100 | Wedge Bonder |
| Towa | PMC-1040 | Transfer Molding |
| Towa | PMC2030-D, PMC2030-D HS, PMC2030-S | Transfer Molding |
| Towa | CPM1080, CPM1080-HP | Compression Molding |
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