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QuanTech Circuit (Thailand)

QUANTECH CIRCUIT (THAILAND) CO., LTD.

电路板示意图 · 企业尚未提供照片

生产基地
Rojana Industrial Park (Ayutthaya)
电路板类型
rigid / HDI / flex
资料管理权
尚未确认
资料核查日期
2026-09-24
01 /

了解企业。

QuanTech Circuit (Thailand) 在 Rojana Industrial Park (Ayutthaya) 生产印刷电路板。 该工厂已投产。 隶属于 Huizhou China Eagle Electronic Technology Inc. (CEE) (China)。

生产基地

该工厂的所有者

泰国法人实体
QUANTECH CIRCUIT (THAILAND) CO., LTD. · บริษัท ควอนเทค เซอร์คิท (ไทยแลนด์) จำกัด
注册号
0145566000524 · 注册于 2023-01-25
注册资本
1,607,556,800 泰铢
股东
Huizhou Zhongjing Electronics Technology Co., Ltd. (惠州中京电子科技股份有限公司, CEE) 99.5%, 2026-06-30[3]; Huizhou Zhongjing Electronics Technology Co., Ltd. through wholly owned subsidiaries (惠州中京电子科技有限公司 and 香港中京电子科技有限公司, 0.25% each per the June 2023 filing) 0.5% (通过 惠州中京电子科技有限公司; 香港中京电子科技有限公司), 2026-06-30[3]
母公司集团
Huizhou Zhongjing Electronics Technology Co., Ltd. (CEE) (惠州中京电子科技股份有限公司) · China · SZSE 002579 · 2025 年营收 3,140,650,093.21 CNY[5]

已公布投资

  • Thailand PCB production base (land, fixed assets), up to: 550,000,000 CNY, 2022-12-23[4]
  • Land purchase in Rojana Industrial Park, Ayutthaya: 246,000,000 THB, 2023-06-15[6]
  • Private placement of up to CNY 700 million, mainly for the Thailand smart production base, Huizhou line upgrades and working capital: 700,000,000 CNY, 2026-04-24[7]

公司已公布的后续计划

  • Main production equipment at the Thailand base has been installed and commissioned, and lines are gradually starting trial production.[8]
  • The base focuses on high-layer-count rigid boards for network communications and automotive electronics.[8]
  • The company lists planned production start in 2026, main products MLB, HLC and HDI, and planned annual capacity of 1.0 million square metres.[9]
  • The private placement for the Thailand base has received CSRC registration approval, with issuance preparations under way.[10]

公司信息来自披露文件、泰国公司登记册、BOI 发布的信息和公司公告。不列出自然人的姓名。

  1. QUANTECH CIRCUIT (THAILAND) CO., LTD. company profile (DBD data). Creden Data (2026)
  2. QUANTECH CIRCUIT (THAILAND) CO., LTD. registered capital (DBD data). Creden Data (2026)
  3. CEE 2026 Semi-Annual Report, composition of the group. Huizhou Zhongjing Electronics Technology Co., Ltd. via CNINFO (2026)
  4. Announcement on obtaining the outbound investment certificate and completing set-up of the Thai subsidiary (2023-007). Huizhou Zhongjing Electronics Technology Co., Ltd. via CNINFO (2023)
  5. CEE 2025 Annual Report, key accounting data. Huizhou Zhongjing Electronics Technology Co., Ltd. via CNINFO (2026)
  6. Progress announcement on the Thai subsidiary (2023-026). Huizhou Zhongjing Electronics Technology Co., Ltd. via CNINFO (2023)
  7. CEE 2025 Annual Report, key work in the year. Huizhou Zhongjing Electronics Technology Co., Ltd. via CNINFO (2026)
  8. CEE 2026 Semi-Annual Report, business review. Huizhou Zhongjing Electronics Technology Co., Ltd. via CNINFO (2026)
  9. Subsidiary: QuanTech Circuit (Thailand). Huizhou Zhongjing Electronics Technology Co., Ltd. (CEE) (2026)
  10. CEE 2026 Semi-Annual Report, refinancing progress. Huizhou Zhongjing Electronics Technology Co., Ltd. via CNINFO (2026)
  11. Subsidiary: QuanTech Circuit (Thailand), Phase I capacity. Huizhou Zhongjing Electronics Technology Co., Ltd. (CEE) (2026)
02 /

确认技术适配性。

电路板类型
rigid · HDI · flex
记录的最高层数
未记录
材料
未记录
表面处理
未记录
记录中的工厂状态
operating: plant formally entered production 15 August 2026

下单前请确认具体电路板、生产地点及当前供货能力。

multilayer boards and HDI; FPC also reported

母公司集团公布的信息

记录的最高层数
28
最小线宽
35 µm
材料
low-loss · Rogers · high-Tg FR-4 · FR-4 · Polyimide
表面处理
OSP · ENIG · ENEPIG · gold finger · immersion tin · immersion silver
已记录的认证
ISO 9001 · ISO 14001 · ISO 45001 · IATF 16949 · ISO 50001 · ISO/IEC 27001 · QC 080000

尚未确认适用于这家泰国工厂。请向工厂确认其在此处生产或持有哪些项目。

03 /

可核查的信任。

买家和供应商适用相同的证据标准。资料管理权获批不代表制造能力或付款可靠性认证。

企业身份
尚未确认
代表权限
尚未公布联系人
支持材料
调研来源见下方
交易历史
此资料不代表任何交易保证。
01 / www.ic-pcb.com ↗02 / www.yuanqu123.com ↗03 / www.marketscreener.com ↗04 / bizthai.com ↗05 / www.ceepcb.com ↗06 / www.ceepcb.com ↗07 / www.ceepcb.com ↗08 / www.ceepcb.com ↗