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供应商 / Si Maha Phot, Prachin Buri (304 Industrial Park) · TH
Gold Circuit Electronics (Thailand)
GOLD CIRCUIT ELECTRONICS (THAILAND) CO., LTD.
电路板示意图 · 企业尚未提供照片
- 生产基地
- 304 Industrial Park
- 电路板类型
- HDI / rigid
- 资料管理权
- 尚未确认
- 资料核查日期
- 2026-09-24
了解企业。
Gold Circuit Electronics (Thailand) 在 304 Industrial Park 生产印刷电路板。 该工厂已投产。 隶属于 Gold Circuit Electronics Ltd. (GCE), 100% owner (held via Goldex Holding Limited per GCE annual reports) (Taiwan)。
生产基地
终端市场: AI networking · AI servers · data centres · servers
该工厂的所有者
- 泰国法人实体
- GOLD CIRCUIT ELECTRONICS (THAILAND) CO., LTD. · บริษัท โกลด์ เซอร์คิท อีเลคโทรนิคส์ (ไทยแลนด์) จำกัด
- 注册号
- 0105566076768 · 注册于 2023-04-11
- 注册资本
- 5,000,000,000 泰铢
- 股东
- Gold Circuit Electronics Ltd. 59.18%, 2025-12-31[2]; Goldex Holding Limited (Samoa; wholly owned by Gold Circuit Electronics Ltd.) 40.82% (通过 Goldex Holding Limited), 2025-12-31[2]
- 母公司集团
- Gold Circuit Electronics Ltd. (金像電子) · Taiwan · TWSE 2368 · 2025 年营收 60,003,758,000 TWD[4]
已公布投资
- Phase one, HDI and multilayer PCB plant, 304 Industrial Park, Prachin Buri (BOI): 8,000,000,000 THB, 2026-05-18[6]
- Phase two expansion approved by BOI: 7,230,000,000 THB, 2026-05-18[6]
- Paid-in capital of the Thai subsidiary: 101,000,000 USD, 2025-12-31[3]
公司已公布的后续计划
- Phase one began mass production in the second half of 2025.[12]
- Construction of phase two has begun, with mass production expected in Q4 2027.[5]
- The parent stated it will continue to invest in the Thai subsidiary in 2026 to meet customer orders.[7]
- Two Gold Circuit Electronics projects were selected for the BOI Thailand FastPass track in December 2025.[8]
公司信息来自披露文件、泰国公司登记册、BOI 发布的信息和公司公告。不列出自然人的姓名。
- GOLD CIRCUIT ELECTRONICS (THAILAND) CO., LTD. company profile (DBD data). Creden Data (2026)
- Gold Circuit Electronics 2025 Annual Report, shares held in investees (31 Dec 2025). Gold Circuit Electronics Ltd. (2026)
- Gold Circuit Electronics 2025 Annual Report, basic information of affiliated enterprises. Gold Circuit Electronics Ltd. (2026)
- Gold Circuit Electronics 2025 Annual Report, review of financial performance (NTD thousand). Gold Circuit Electronics Ltd. (2026)
- Gold Circuit Electronics 2025 Annual Report, business plan for 2026. Gold Circuit Electronics Ltd. (2026)
- BOI อนุมัติ 3 โครงการใหญ่ PCB ทุ่มเฟสสอง 22,000 ล้านบาท. Techsauce (2026)
- Gold Circuit Electronics 2025 Annual Report, investment plan for the coming year. Gold Circuit Electronics Ltd. (2026)
- BOI Thailand FastPass first batch of 16 projects. The Nation (2025)
- GCE corporate website (Chinese). Gold Circuit Electronics Ltd. (2026)
- GOLD CIRCUIT ELECTRONICS (THAILAND) CO., LTD. registered capital (DBD data). Creden Data (2026)
- Gold Circuit Electronics 2025 Annual Report, cover. Gold Circuit Electronics Ltd. (2026)
- Gold Circuit Electronics 2025 Annual Report, business plan for 2026. Gold Circuit Electronics Ltd. (2026)
- Gold Circuit Electronics 2025 Annual Report, shares held in investees (31 Dec 2025). Gold Circuit Electronics Ltd. (2026)
确认技术适配性。
- 电路板类型
- HDI · rigid
- 记录的最高层数
- 未记录
- 材料
- 未记录
- 表面处理
- 未记录
- 记录中的工厂状态
- operating (since H2 2025): phase 2 mass production targeted Q4 2027
下单前请确认具体电路板、生产地点及当前供货能力。
Registered business under BOI: HDI PCB. BOI lists multilayer and HDI. Group technology (not plant-specific): high layer count, HDI, heavy copper, backplane.
母公司集团公布的信息
- 电路板类型
- rigid · HDI
- 记录的最高层数
- 56
- 材料
- low-loss
- 已记录的认证
- ISO 9001 · QC 080000 · IATF 16949 · ISO/IEC 27001 · ISO 14001 · ISO 45001 · ISO 50001
尚未确认适用于这家泰国工厂。请向工厂确认其在此处生产或持有哪些项目。
可核查的信任。
买家和供应商适用相同的证据标准。资料管理权获批不代表制造能力或付款可靠性认证。
- 企业身份
- 尚未确认
- 代表权限
- 尚未公布联系人
- 支持材料
- 调研来源见下方
- 交易历史
- 此资料不代表任何交易保证。