MPBx / PCB ENGINEERING LAB

Geometry.
Meet performance.

Explore the relationship between copper, dielectric and signal. Change a dimension. Inspect the consequences. Build an engineering study you can take to a fabricator.

01 / ENGINEERING WORKBENCH

Every micron changes the answer.

Nominal impedance50.6Ω

50 Ω ±10% · inside target

8 tolerance corners44.6–57.0Ω

Some corners outside target band

Propagation delay583ps

100 mm · εeff 3.050

Remaining annular ring100µm

After offset · 0.050 mm

Change the physical geometry. Inspect the calculated response.

CROSS-SECTION / DIMENSIONEDANALYTICAL MODEL
A—A / SURFACE MICROSTRIPL1 → L2w = 0.320 mmh0.180t = 35 µmDk 4.20 / εeff 3.050L2 / CONTINUOUS REFERENCE PLANEw/h 1.78

Move the slider. Watch the geometry, impedance and tolerance envelope respond together.

IMPEDANCE / TRACE WIDTHΩ02550751000.0750.30.60.91.21.5w / mmGOLD BAND = TARGET · VERTICAL BAR = 8 CORNERS
02 / VARIATION STUDY

The nominal answer is only the start.

Eight independent extremes of width, dielectric height and Dk; copper is fixed. These are model bounds, not a prediction of manufacturing yield.

Inspect all eight corners
Tolerance combinations
w / mmh / mmDkZ₀ / Ω
0.2950.1624.0050.77
0.2950.1624.4048.72
0.2950.1984.0056.99
0.2950.1984.4054.70
0.3450.1624.0046.45
0.3450.1624.4044.55
0.3450.1984.0052.43
0.3450.1984.4050.31
03 / REVISION COMPARISON

Change it. Measure the difference.

Capture a baseline above, then change the geometry to compare impedance, delay, remaining ring and central dielectric. Your study stays in this browser tab; export it before leaving.

Model assumptions, limits & sources

Hammerstad–Jensen quasi-static surface microstrip with copper-thickness correction. Uniform Dk, uncoated trace, continuous ground. Solder mask, frequency dispersion, roughness, losses, differential coupling and via discontinuities are excluded. This is an early-design estimate, not a field solver or production approval.

Ring = (pad − production drill) / 2 − radial offset. Aspect = copper/dielectric total / production drill. Bore ≈ drill − 2 × hole-wall copper. Supplier limits shown here are editable examples. Confirm drill tolerance, plating, registration, final stack-up and a controlled-impedance coupon with your fabricator.

Hammerstad–Jensen / Qucs ↗Annular rings / Eurocircuits ↗Drilling tolerances / Eurocircuits ↗

Explore the manufacturing journey 06 STAGES ↗

A separate illustrative specimen. These appearance choices and the quote starter below are independent of the engineering study above. Export the study to retain its technical values.

SPECIMEN 001 / FR-4Illustrative board · no uploaded files
MPBX / FAB LAB100 × 80 mm · 4LL4L1ISOMETRIC / COPPERILLUSTRATION · NOT TO SCALE
YOUR TURN

Change one thing.
See a different board.

These are starting choices. Your factory must confirm the final construction and manufacturing requirements.

Copper layers
Surface finish
Solder mask
FROM EXPLORING TO MAKING

Make the next one yours.

4L · 100 × 80 mm · FR-4 · 1.6 mm · ENIG

An interactive illustration of a conventional rigid PCB journey. Steps are grouped; actual factory processes vary. Colours, copper patterns and layer spacing are illustrative. This is not a manufacturability check or an electrical simulation.

Explore the engineering references: Manufacturing process · Inside the layers · Final inspection

Take these choices into a request?

You will review the specification, add quantities and drawings, and choose what to publish in the request form.

4L · 100 × 80 mm · FR-4 · 1.6 mm · ENIG