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供应商 / Bangkok (Lat Krabang IE) · TH
KCE Electronics
KCE ELECTRONICS PUBLIC COMPANY LIMITED
电路板示意图 · 企业尚未提供照片
- 生产基地
- Lat Krabang Industrial Estate
- 电路板类型
- HDI / metal core / rigid
- 资料管理权
- 尚未确认
- 资料核查日期
- 2026-09-24
了解企业。
KCE Electronics 在 Lat Krabang Industrial Estate 生产印刷电路板。 该工厂已投产。
生产基地
终端市场: automotive · consumer · industrial · medical · telecom
该工厂的所有者
- 泰国法人实体
- KCE ELECTRONICS PUBLIC COMPANY LIMITED · บริษัท เคซีอี อีเลคโทรนิคส์ จำกัด (มหาชน)
- 注册号
- 0107535000354 · 注册于 1992-12-21
- 注册资本
- 591,044,298 泰铢
- 股东
- individual shareholder(s) 34.68%, 2025-12-30[3]; APCO CAPITAL PTE. LTD. (part of the largest shareholder group) 4.23%, 2025-12-30[4]; Thai NVDR Company Limited (non-voting depositary receipts) 6.49%, 2025-12-30[5]
- 母公司集团
- KCE Electronics Public Company Limited (บริษัท เคซีอี อีเลคโทรนิคส์ จำกัด (มหาชน)) · Thailand · SET KCE · 2025 年营收 13,338,577,230 THB[6]
已公布投资
- New PCB factory and machinery at Rojana Industrial Park, Ayutthaya, 1 million sq ft per month (announced November 2022): 8,060,000,000 THB, 2022-11[7]
公司已公布的后续计划
- The company keeps flexibility to proceed with capacity expansion once market demand shows a clearer and stronger recovery.[8]
- Refined equipment specifications and line layouts are expected to reduce investment costs when the expansion project resumes.[9]
- KCE and its subsidiary KCE Technology make multilayer PCBs of 4 to 40 layers as well as semi-flex and HDI boards.[10]
公司信息来自披露文件、泰国公司登记册、BOI 发布的信息和公司公告。不列出自然人的姓名。
- KCE ELECTRONICS PUBLIC COMPANY LIMITED company profile (DBD data). Creden Data (2026)
- KCE ELECTRONICS PUBLIC COMPANY LIMITED registered capital (DBD data). Creden Data (2026)
- KCE One Report 2025, list of major shareholders (as of 30 Dec 2025). KCE Electronics PCL (2026)
- KCE One Report 2025, list of major shareholders. KCE Electronics PCL (2026)
- KCE One Report 2025, list of major shareholders. KCE Electronics PCL (2026)
- KCE One Report 2025, financial summary. KCE Electronics PCL (2026)
- KCE One Report 2025, material changes and developments. KCE Electronics PCL (2026)
- KCE One Report 2025, management discussion and analysis. KCE Electronics PCL (2026)
- KCE One Report 2025, management discussion and analysis. KCE Electronics PCL (2026)
- KCE One Report 2025, products. KCE Electronics PCL (2026)
- KCE One Report 2025, general information. KCE Electronics PCL (2026)
- KCE One Report 2025, related parties. KCE Electronics PCL (2026)
- KCE One Report 2025, management discussion and analysis. KCE Electronics PCL (2026)
确认技术适配性。
- 电路板类型
- HDI · metal core · rigid
- 记录的最高层数
- 40
- 最小线宽
- 75 µm
- 材料
- FR-4 · halogen-free FR-4
- 表面处理
- ENIG · hard gold · immersion tin · immersion silver · OSP · lead-free HASL · carbon ink
- 记录中的工厂状态
- operating (since 1982): new Rojana factory postponed in 2025
下单前请确认具体电路板、生产地点及当前供货能力。
mSAP with LDI and vacuum etching; ELIC (every-layer interconnect) HDI; semi-flex (depth-routed) PCB; heavy copper of 105 um (3 oz) or more; copper inserts and heat-sink integration; high-speed/high-frequency low-loss boards
可核查的信任。
买家和供应商适用相同的证据标准。资料管理权获批不代表制造能力或付款可靠性认证。
- 企业身份
- 尚未确认
- 代表权限
- 尚未公布联系人
- 支持材料
- 调研来源见下方
- 交易历史
- 此资料不代表任何交易保证。
已记录的认证
ISO 9001 · IATF 16949 · ISO 45001 · ISO 14001 · ISO 50001 · TLS 8001
仅为调研记录。请索取有效证书、颁发机构及适用工厂范围。